Assoc. Prof. Dr. Martin Anselm | Microstructure | Best Researcher Award

Rochester Institute of Technology, United States

👨‍🎓Profiles

• Scopus Profile
• Google Scholar

Early Academic Pursuits 🎓

Martin K. Anselm’s academic journey began with a solid foundation in the field of physics, earning a BA in Physics from the State University of New York at Geneseo in 1999. He then progressed to Clarkson University in Potsdam, NY, where he completed his MS in Mechanical Engineering in 2002. This was followed by a deep dive into the realm of materials science, culminating in a Ph.D. in Materials Science & Engineering from Binghamton University in 2011. His academic background is rich in technical knowledge, specifically focused on materials science and mechanical engineering.

Professional Endeavors 🌍

Dr. Anselm currently serves as an Associate Professor in Manufacturing, Mechanical & Electromechanical Engineering Technology at Rochester Institute of Technology (RIT). With a commitment to advancing both academic knowledge and industry collaboration, he plays a vital role in the CEMA Lab at RIT, which heavily relies on industry-backed research projects and cutting-edge industrial manufacturing equipment. His engagement with Surface Mount Technology Association (SMTA) stands out, as he served as SMTA President (2020 - present) and has contributed as SMTA Board Member from 2013 to 2019, alongside holding leadership roles within the Empire Chapter of SMTA. His influence within the electronics manufacturing sector has helped steer numerous initiatives that bridge academia and industry.

Contributions and Research Focus 🔬

Dr. Anselm's research is deeply rooted in electronics solder joint fracture mechanics and microstructural evolution in fatigue, which is crucial for the long-term reliability and performance of electronic components. His other areas of expertise include semiconductor device packaging, electronics assembly manufacturing, and electronics reliability modeling and test development. His work in these domains supports industries that require reliable electronic components for use in everything from consumer electronics to critical infrastructure. His research contributions also extend to the practical aspects of electronics manufacturing, where he is dedicated to improving the quality and durability of solder joints and devices.

Impact and Influence 🌟

Dr. Anselm’s research is influential in both academic and industry circles. His involvement in the SMTAI conference has enabled him to share his expertise and contribute to the dissemination of cutting-edge research in electronics manufacturing. By actively engaging with industry partners, he has helped shape research projects that align with real-world manufacturing challenges. This collaboration has not only resulted in technological advancements but has also provided RIT students and faculty with access to advanced industrial manufacturing equipment, fostering hands-on learning opportunities.

Academic Citations 📚

As a thought leader in his field, Dr. Anselm’s work has been widely cited in academic circles, particularly within the realm of electronics manufacturing and materials science. His research contributions are frequently referenced by professionals seeking insights into the fracture mechanics of solder joints and electronics reliability, highlighting the significant impact his work has on both academia and the broader electronics industry.

Technical Skills 🔧

Dr. Anselm possesses extensive technical skills in areas including electronics assembly manufacturing, reliability testing, and materials characterization. His expertise in solder joint fracture mechanics is complemented by proficiency in microstructural analysis, which is essential for understanding how fatigue impacts the longevity of electronic components. Additionally, his experience with semiconductor packaging and electronics reliability modeling allows him to offer solutions to complex problems encountered in the design and manufacturing of electronic devices.

Teaching Experience 📖

Dr. Anselm’s teaching career is marked by his involvement in courses such as Science of Engineering Materials (ME272) and Processes for Electronics Manufacturing (SSIE 578) at Binghamton University. His instructional approach focuses on integrating academic theory with practical application, ensuring that students are well-prepared for careers in electronics manufacturing and related fields. As an educator, he has not only imparted technical knowledge but also mentored students in research, helping to nurture the next generation of engineers.

Legacy and Future Contributions 🌱

Looking ahead, Dr. Anselm is poised to continue making significant contributions to the field of electronics manufacturing, particularly in improving the reliability of solder joints and advancing semiconductor device packaging. His research is expected to influence the development of more resilient and efficient electronic components that will be critical as industries move towards more compact, high-performance devices. As a mentor and leader, his legacy will be carried forward through his students and the ongoing collaboration between RIT and industry partners.

📖Notable Publications

• The Effect of Extended Dwell Time on Thermal Cycling Performance of Hybrid Low Temperature Solder Joints

  • Authors: Coyle, R., Anselm, M., Feng, C., Popowich, R.
  • Journal: Proceedings - Electronic Components and Technology Conference
  • Year: 2024

• Robustness of High Tension, Standard Tension and Mesh Mount SOLDER PASTE STENCILS

  • Authors: Kotian, P., Schake, J., Anselm, M.
  • Journal: Printed Circuit Design and Fab/Circuits Assembly
  • Year: 2020

• Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell with Resonance Tracking

  • Authors: Su, Q.T., Gharaibeh, M.A., Stewart, A.J., Pitarresi, J.M., Anselm, M.K.
  • Journal: Journal of Electronic Packaging
  • Year: 2018

• QFN reliability, thermal shock, lead-free vs. SnPb, microstructure

  • Authors: Anselm, M.K., Ghaffarian, R.
  • Conference: Proceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017
  • Year: 2017

• Research opportunities in the industry: Chaired by someone not in this portion of the electronics industry...: Apologies in advance

  • Authors: Anselm, M., Beckmann, K., Yiqiang, W.H., Kempf, T., Morillon, D.
  • Conference: IEEE International Integrated Reliability Workshop Final Report
  • Year: 2017

• Package reliability: How can we use ideas/methods from semiconductor reliability in package reliability?

  • Authors: Kopley, T., Pozder, S., Anselm, M., Siddiqui, J., Haase, G.
  • Conference: IEEE International Integrated Reliability Workshop Final Report
  • Year: 2017

• Industry trends in photonics packaging: Passive fiber and die coupling

  • Authors: Thomas, S., Bastardo, K.Y., Anselm, M.K.
  • Conference: 2017 Pan Pacific Microelectronics Symposium, Pan Pacific 2017
  • Year: 2017